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Package Development Engineer M/V/X

Référence 5870483 | Créé le 12 juin 2026

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  • Lieu : 3001 - Heverlee
  • Temps de travail : Temps plein
  • Type de contrat : Durée indéterminée
  • Famille de métiers : Etudes, recherche et développement / Recherche fondamentale et appliquée
  • Nombre d'années d'expérience : Minimum 4 ans d'expérience

Description de la fonction

This position can be in Heilbronn and in Leuven

What you will do

Your assignment consists of the following tasks:

  • Package Selection and Analysis?Select an appropriate IC package type based on the given specifications and IC
    requirements. Perform a comprehensive analysis of the chosen package's electrical characteristics. Identify any limitations or potential issues that may arise during the design process.
  • Electrical Performance Optimization?Optimize the electrical performance of the IC package by focusing on signal
    integrity, power integrity, and electromagnetic compatibility (EMC). Analyze the routing, parasitic effects, and noise issues associated with the package. Propose design modifications or enhancements to improve electrical performance.
  • Design for Manufacturability and Cost Optimization?Consider manufacturability and cost optimization aspects of
    the IC package design. Review the design for compatibility with manufacturing processes, assembly requirements, and
    materials availability. Suggest design modifications to streamline the manufacturing process while maintaining or reducing overall costs.
  • Documentation and Reporting?Produce a comprehensive report summarizing your analysis, design modifications, and
    optimization recommendations for the IC package. Include detailed diagrams, simulations, calculations, and experimental results where applicable. Clearly communicate the rationale behind your design decisions and their potential impact on the IC's performance and reliability.

Profil

Who you are

  • MSc in the field of electronics & equivalent with at least 5 years of experience in packaging design as well as SIPI analysis
  • Knowledge in Cadence layout tools
  • Knowledge in Ansys simulation tools
  • Knowledge in 2.5D/3D packaging, backend silicon layout (place & route)
  • To be able to communicate in English is a must

Compétences linguistiques

  • Anglais (atout)

    • Comprendre : Expérimenté - (C1)
    • Écrire : Expérimenté - (C1)
    • Lire : Expérimenté - (C1)
    • Parler : Expérimenté - (C1)

Avantages du poste

What we do for you

We offer you the opportunity to join one of the world's premier research centers in nanotechnology at its office in Heilbronn, Germany. With your talent, passion and expertise, you'll become part of a team that makes the impossible possible. Together, we shape the technology that will determine the society of tomorrow.

We are committed to being an inclusive employer and proud of our open, multicultural, and informal working environment with ample possibilities to take initiative and show responsibility. We commit to supporting and guiding you in this process; not only with words but also with tangible actions. Through imec.academy, 'our corporate university', we actively invest in your development to further your technical and personal growth.

We are aware that your valuable contribution makes imec a top player in its field. Your energy and commitment are therefore appreciated by means of a market appropriate salary with many fringe benefits.

Envie d'en apprendre davantage sur ce métier ou sur un métier proche de celui-ci ? Parcourez toutes les informations utiles sur Panorama des métiers. Panorama des métiers

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Comment postuler ?

Nom de l'employeur
INTERUNIVERSITAIR MICRO-ELECTRONICA CENTRUM
Personne de contact
Sandra kolaric
Mode de présentation
postuler via le site Web
Website
Site de l’employeur